SAC305 no-clean solder paste is a no-clean solder paste designed for today's SMT processes. Refined with special solder paste and spherical tin powder with very low oxide content. Excellent continuous printing resolution: In addition, the solder paste contained in this product uses a low-reliability activator system with high reliability, so that it has very little residue after reflow and has high insulation Impedance, even with no-wash, can have extremely high reliability. In addition, the SAC305 series of disposable solder pastes can provide different alloy compositions, different tin powder particle sizes, and different metal contents to meet customer requirements for different products and processes.