Low temperature (Bi58) lead-free solder paste is made by using special solder paste and spherical tin powder with very low oxide content. It has excellent continuous printing resolution; in addition, the solder paste contained in this product uses high Reliable low-ionic halogen activator system, so that the residue after reflow, even without washing, can have a very high reliability.
Printing characteristics
1.) During continuous printing, its viscosity rarely changes at any time, and very stable printability can be obtained.
2.) It has excellent weldability and can show proper wettability in different parts.
3.) Can be applied to reflow furnaces under normal atmosphere and nitrogen.
4.) Can accurately control solder powder, 38-63 um, special flux to ensure good continuous printing and fine patterns.
5.) Bi series is a low melting point solder, which may allow lower heat resistance parts and substrates to be used to reduce costs.
6.) Good weldability can also be obtained at extremely high peak temperature.