Sn / Ag0.3 / Cu0.7 high temperature lead-free solder paste is made of special flux and spherical tin-silver-copper alloy powder with very low oxide content. Excellent continuous printing resolution; In addition, the solder paste contained in this product uses a highly reliable low-ionic halogen activator system to make the residue after reflow extremely high even if it is no-clean Reliability. The tin-silver-copper alloy used in this product has been widely used internationally.
Printing characteristics
1.) During continuous printing, its viscosity has little change over time, and very stable printability can be obtained.
2.) For circuits with a pitch of 0.4 mm or more, fine printing can be completed.
3.) It has excellent weldability and can exhibit proper wettability in different parts.
4.) Applicable to reflow furnaces under normal atmosphere and nitrogen.
5.) Good weldability is also obtained at extremely high peak temperatures.